Optoelectronic Packaging Engineer

About Xanadu

Xanadu’s mission is to build quantum computers that are useful and available to people everywhere.

At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems, and literally change the world. And that is something to be excited about!

Role and responsibilities:

As part of the Hardware Team in Toronto, you will take your experience in delivering high-performance optoelectronic chip packaging solutions, and apply it to Xanadu's rack-scale quantum computer development. In the role of optoelectronic packaging engineer, you will join a growing team to model the elements that make up our complex photonic assemblies, as well as design and produce robust optomechanical and assembly solutions to implement them. 

Required qualifications and experience:

• BSc or higher in mechanical engineering, materials science or a relevant related discipline
• 3+ years of industry experience in a relevant discipline
• Experience with thermo-mechanical and stress simulations to achieve optimal thermo-mechanical stability and uniformity of photonic integrated circuits with large fibre arrays.
• Experience with root cause failure analysis (RCFA) and failure modes and effects analysis (FMEA).
• Proficiency in die attaches, fibre attaches and heatsink technologies.
• Proficiency in wafer scale and system-level characterization and analysis.
• Self-motivated, comfortable working both independently and collaboratively with people of all disciplines on complex projects in a fast-paced environment
• Strong interpersonal skills

Preferred qualifications and experience -- candidates should have at least 4 of the following:

• MSc in mechanical engineering, materials science or a relevant related discipline
• 5+ years experience in delivering photonic packaging solutions in an industry or industry-supporting role
• Experience in optomechanical CAD simulation, including stress and warp impacts of wire bonding and die attach
• Familiarity with standards and test methods for assessing the reliability 
• Strong understanding of device assembly cost, testing cost and yield
• An exceptional candidate will have experience simulating electrical performance in Ansys HFSS, Keysight ADS or similar software tools.

Values

Our values are important. They are fundamental and lay the foundation for culture at Xanadu. Learn more about our values here. 

At Xanadu, we are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier-free workplace. Should you require accommodations at any point during the recruitment process please contact Human Resources at hr@xanadu.ai.

At Xanadu, we are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier-free workplace. Should you require accommodations at any point during the recruitment process please contact Human Resources at hr@xanadu.ai.